Amkor Technology, Inc. a leading provider of semiconductor packaging and test services, has marked the start of its advanced packaging and test campus in Arizona, a major initiative carried out with the support of the Trump Administration. The move expands Amkor’s footprint in the U.S., with the total investment rising from $2 billion to $7 billion across two phases of development. The event brought together government officials, technology executives, and community representatives to mark a new phase in strengthening the nation’s semiconductor manufacturing base. The facility will be the first high-volume advanced packaging site of its kind in the United States.
Once both phases are completed, the campus will include more than 750,000 square feet of cleanroom space and create up to 3,000 skilled jobs. The first manufacturing building is expected to be completed by mid-2027, with production to begin in early 2028. Supported by the CHIPS for America Program, the Advanced Manufacturing Investment Tax Credit, and various state and local initiatives, Amkor’s new facilities will anchor the country’s semiconductor packaging and testing capabilities for major clients including Apple and NVIDIA.
“This groundbreaking represents a bold step in Amkor’s long-term strategy for growth and innovation,” said Giel Rutten, Amkor’s president and chief executive officer. “We’re building a facility to meet our customers’ most advanced needs that will help shape the future of semiconductor manufacturing in the United States. Arizona offers the right mix of talent, infrastructure, and industry presence, and we’re proud to deepen our roots here.”
Situated within Arizona’s expanding high-tech corridor, the site is designed to become one of the nation’s most sophisticated outsourced semiconductor packaging and testing centers. It will feature smart factory systems and scalable production lines aimed at meeting growing demand in artificial intelligence, high-performance computing, mobile communications, and automotive markets. The facility’s capabilities will complement TSMC’s wafer fabrication operations, enabling end-to-end semiconductor production within the U.S.
“President Trump’s leadership is bringing all stages of semiconductor manufacturing back to the United States,” stated U.S. Secretary of Commerce, Howard Lutnick. “Our partnership with Amkor will bring high volume advanced packaging to the U.S. for the first time, supporting our leading AI industry capabilities and American innovation.”
“This new Amkor facility groundbreaking represents a testament to what is possible when industry leaders share a common vision and work together to build a resilient, end-to-end supply chain right here in the U.S.,” added Jun He, vice president, Advanced Packaging Technology and Service at TSMC. “Our collaboration in Arizona will provide customers with a streamlined, domestic ecosystem, designed to help define the future of local semiconductor manufacturing.”