Bostik launches smart blister packaging solution for the pharma products

Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, has launched HERBERTS™ EPS 8760/KN75, a high-performance, smart adhesive that has been designed to improve the process automation of cold forming blister packaging for the pharmaceutical industry.

Pharmaceutical products must meet high hygiene and safety standards to preserve the strength of the active ingredients, as any changes in these factors can have severe consequences for the consumer. HERBERTS™ EPS 8760/KN75 is compliant with local standards for drug safety.

Made for nylon, aluminum and PVC (NY/AL/PVC), HERBERTS™ EPS 8760/KN75 presents stable bonding strength and exceptional deep drawing performance to provide excellent long-term delamination resistance and retention of packaging structure even after extended periods. This leads to effective quality and process handling control, as well as maximised production speed and reliability.

HERBERTS™ EPS 8760/KN75 can be utilised on unit-dose packaging for pharmaceutical tablets, capsules or lozenges, presenting excellent clarity and clean optical appearance compared to existing market solutions.

Additionally, the innovative adhesive provides impermeable barrier protection from elements such as oxygen and moisture ingress, aroma, and lights, thus extending the shelf life of the products.

Due to the effects of COVID-19, the demand for blister packaging has increased tremendously. Currently, around 70% of blister packaging needs come from the pharmaceutical industry. Given the rising pressure to manufacture more medications, factors such as product integrity and prolonged shelf life are highly imperative, considering that most consumers store their medications in temperature variant atmosphere that can damage their quality.

“Blister packaging made from HERBERTS™ EPS 8760/KN75 adhesive system is a high quality and cost-effective alternative to plastic containers or bottles. This, combined with the security, integrity and durability it presents, makes the innovate adhesive an attractive investment for companies in the industry looking to maximise efficiency while minimising expenditure.” said Daniel Thong, Regional Market Manager for Flexible Packaging, Industrial Adhesives Asia, Bostik.

Bostik will be exhibiting at Chinaplas 2021, held on 13 – 16 April 2021 in Shenzhen. The new HERBERTS™ EPS 8760/KN75 will be showcased at Bostik’s booth 13H31.